IPC/JEDEC J-STDC. Handling, Packing,. Shipping and Use of. Moisture/ Reflow. Sensitive Surface. Mount Devices. A joint standard. IPC/JEDEC J-STDC-1 -. August IPC/JEDEC J-STDC -. February IPC/JEDEC J-STDB.1 includes Amendment 1 -. complies with ipc/JEDEc J-stDA. 3M™ HIC this card meets the IPC /JEDEC J-STD-. A standard. card size: 2” x 3” inches indicates: 5,10,15%.

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Already Subscribed to this document. If all moisture absorption ioc are taken and connectors are still exhibiting some delamination during SMT assembly, measuring the amount of moisture in the parts jeded determine the steps required to solder without connector blistering may be required.

Higher temperatures required for lead-free SMT soldering will force a change from many currently used connector housing resins, which will melt, suffer pin retention failures or fail to meet dimensional stability requirements.


The key parameter in blistering of connector housings is the control of moisture absorption in the molded parts. 033s solders result in higher peak temperatures, meaning more blistering. The company compared three moisture measurement techniques: The higher the peak temperature, the lower the moisture content can be before blistering.

Table 3 shows that, at the k conditions of an air-conditioned warehouse in Southeast Asia Condition 1even the thinnest tested LDPE bag would provide enough moisture protection to keep the connectors below the blister threshold level for 90 days.


Many Asian OEMs, who have been converting to the lead-free solder process for the last few years, require that their connectors be packaged to minimize moisture absorption for this reason. Approved options include clay and silica gel.

Minimizing Effects of Lead-free SMT Assembly on Connector Housing Resins

All techniques provided similar moisture percentages in parts. The higher preheat temperatures typical in lead-free solder profiles i;c provide more safety from blistering for thinner-walled parts than current tin-lead solder profiles due to the direct relationship between moisture desorption rate and temperature.

By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life i;c 12 months from the seal date when using sealed dry bags. The vapor pressure of moisture and other gases trapped inside the walls of a plastic connector increase rapidly when the connector is exposed to the high temperatures of solder reflow.

CARD, HUMIDITY INDICATOR, 5% 10% 15% RH, J-STDA | Arbell Electronics Distributor

Your Alert Profile lists the documents that will be monitored. This standard is also available to be included in Standards Subscriptions. Please first log in with a verified email before subscribing to alerts. They were subjected to two different storage conditions: Key to elimination of blistering is moisture control for most of the temperature-capable engineering resins used in connector housings.

Board assemblers have focused on handling more expensive ICs but have failed to take similar precautions with board connectors.


We have no amendments or corrections for this standard. Proceed to Checkout Continue Shopping. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.

MBBs in two different thicknesses 0. Some materials currently used may deform melt or show signs of delamination on the side walls, referred to as “blistering. As the voice of the U.

Figures 1 and 2. Effectiveness of desiccant on moisture absorption of packaged connectors. This standard is not included in any packages.

Subscription pricing is determined by: In this stage, the higher liquidus temperatures required for lead-free solders may have a profound effect on the connector insulator housings.

The company has analyzed the types of bags that are available for connector packaging and come up with some recommendations based upon WVTR ratings Table 2. You may delete a document from your Alert Profile at any time. For standard MBB sizes used for shipping connectors loose or on reels the i of desiccant required is less than two units. Many connector suppliers are eliminating, or have already eliminated, lead from their contact plating process.

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